- All sections
- H - Electricity
- H04N - Pictorial communication, e.g. television
- H04N 25/79 - Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
Patent holdings for IPC class H04N 25/79
Total number of patents in this class: 233
10-year publication summary
|
0
|
0
|
0
|
1
|
2
|
4
|
33
|
54
|
95
|
37
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Sony Semiconductor Solutions Corporation | 8770 |
81 |
| Nikon Corporation | 7162 |
29 |
| Canon Inc. | 36841 |
23 |
| Samsung Electronics Co., Ltd. | 131630 |
18 |
| Sony Group Corporation | 10730 |
17 |
| Sony Corporation | 32931 |
5 |
| Semiconductor Energy Laboratory Co., Ltd. | 10902 |
5 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
3 |
| SK Hynix Inc. | 11030 |
3 |
| Sony Advanced Visual Sensing AG | 51 |
3 |
| Nuvoton Technology Corporation Japan | 420 |
3 |
| Adeia Imaging LLC | 31 |
3 |
| FUJIFILM Corporation | 27102 |
2 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
2 |
| Depuy Synthes Products, LLC | 2880 |
2 |
| OmniVision Technologies, Inc. | 1502 |
2 |
| ams Sensors USA Inc. | 24 |
2 |
| META Platforms Technologies, LLC | 4806 |
2 |
| Apple Inc. | 50209 |
1 |
| NEC Corporation | 32703 |
1 |
| Other owners | 26 |